Posts By Techmezine
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1.0KTest & MeasurementRanLOS and Anritsu Unveil Innovative 5G Vehicle OTA Test Solution
Versatile and cost-effective antenna OTA test solution designed for seamless integration with existing EMC chambers AeroGT Labs, and Anritsu today announced the...
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874Farnell element14Newly launched SBC BeagleV® Fire now available from element14
The revolutionary new BeagleV®-Fire features powerful performance and new connectivity options element14 has announced a new addition to its single-board computing (SBC)...
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713UncategorizedDigiKey Announces Global Partnership with Super Low Power IC Provider Ambiq
DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, today...
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859Top 10 NewsFischer Connectors’ versatile and miniature UHD audio/video connectivity solutions allow for 18 Gbit/s data transfer speed
Fischer Connectors has released new high-speed connectors and cable assemblies for Ultra High Definition (UHD) audio/video data transfer at 18 Gbit/s in...
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930AutomationSmart-Ex® 03 – the new intrinsically safe 5G smartphone from Pepperl+Fuchs for future-oriented digitalization of hazardous areas
Pepperl+Fuchs presents the intrinsically safe Smart-Ex® 03, a new and future-proof 5G- and Wi-Fi 6-enabled smartphone that was developed entirely in-house in...
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889AutomationHigh-performance identification system—one-of-a-kind detection range, multitag capability and seamless integration
With the IQH3-FP-V1 and IQT3-FP-IO-V1 RFID read/write devices, Pepperl+Fuchs is introducing two new high-performance products for solving identification tasks, combining the advantages...
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1.0KTest & MeasurementAnritsu and Bluetest supporting OTA measurements on IEEE 802.11be (Wi-Fi 7) devices
Anritsu and Bluetest combine their recent product upgrades to create an Over-the-Air (OTA) measurement*1 solution for verifying RF performance in tri-frequency bands...
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1.1KElectronics ComponentCOSEL launches new generation of ultra-compact, high efficiency power supplies for industrial applications
Wide Band Gap Gallium Nitride (GaN) power stage and planar magnetics 3 inch high power density design (TEP45F, 65F) 45W and 65W...
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1.1KRenesasRenesas’ New Ultra-High Performance MCUs are Industry’s First Based on Arm Cortex-M85 Processor
New RA8 Series Devices Deliver Industry-Best 6.39 CoreMark/MHz Performance to Bridge the MCU/MPU Gap Includes Arm Helium Technology to Boost DSP and...
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1.1KTop 10 NewsNavitas Wins Samsung Galaxy S23 Phone 25W Fast Charger Design
From S22 to S23, next-gen GaNFast technology continues to replace legacy silicon power chips in ultra-portable, fast-charging mobile market Navitas Semiconductor (Nasdaq:...
