Heilind
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163TE – SIM Card Connectors
SIM (Subscriber Identity Module) and UIM (Universal Identity Module) cards are widely used in a variety of mobile applications, including, billing, security...
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238TE – Z-Pack High-Speed Backplane Solutions
TE Connectivity’s (TE) Z-PACK HM-ZD connector portfolio provides data rates of up to 56 Gbps while retaining backwards compatibility with previous versions...
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205TE – Magnetic Modular Jacks
TE Connectivity’s (TE) modular jacks with integrated magnetics offer a highly integrated connectivity solution from the cable to the physical layer for...
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225TE – HDMI 2.1 Connector
TE Connectivity’s (TE) high-definition multimedia interface (HDMI) 2.1 technology is the next-generation interface for consumer electronics products such as digital television, set-top...
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205TE – 0.8 MM Low-Profile IDC Connector System
Meeting the industry need for small centerline wire-to-board connectors with a convenient insulation displacement contact (IDC) termination, 0.8 mm low-profile IDC connectors...
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240Molex – MX-DaSH Connectors
The MX-DaSH (Molex Data-Signal Hybrid) Connector System combines high-speed data, signal and power into one connector that can replace multiple traditional connectors...
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224Molex – Easy-On FFC/FPC Connectors, FlatLock Series
Space savings and design flexibility are essential considerations for connectors and cables in small devices. The Easy-On FFC/FPC Connectors, FlatLock Series (0.50mm...
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751Heilind Asia: Driving Growth Through Interconnect Expertise and Localized Support
Interviewee: Dennis Chung, Sales Manager of Heilind Asia Pacific Question 1: How did Heilind establish its presence in Asia, and what has...
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500Market Insights – Q2 2025 Interconnect Industry Trend Analysis | Latest Market Report from Heilind
As the second half of 2025 unfolds, the global market faces multiple challenges, including macroeconomic fluctuations, tariff uncertainties, and ongoing supply chain...
