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197Orbbec Breaks Ground on New Overseas Manufacturing Base RVMC to Enhance Global Delivery and Supply Chain Capabilities
Orbbec officially held the groundbreaking ceremony for its overseas manufacturing base — the RVMC Factory — in the Thuan Thanh Industrial Zone...
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227BenQ Qisda Group Highlights Practical AI Applications and Ecosystem Integration at COMPUTEX 2026
Through four business categories, the Group presents how AI is being deployed across industries to improve productivity, operational efficiency, and decision-making. BenQ...
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249ROHM at PCIM Europe 2026
Advancing SiC Power Technology for E-Mobility and Industry ROHM will exhibit at PCIM Expo & Conference 2026, the leading international event for...
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297Critical Manufacturing Named in 2026 Gartner® Market Guide for MES
The report highlights a broader shift towards more connected manufacturing systems Critical Manufacturing, the Industrial Operations Platform company that unites execution, connectivity,...
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130Photonics research at heart of €370B European tech boom, new study finds
A major new study has revealed that Europe’s university spinout companies have grown into a technology ecosystem worth hundreds of billions of...
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271Infraeo to Showcase High Speed Connectivity Solutions with VIAVI Solutions at OFC 2026
Infraeo and VIAVI to demonstrate 800G and 1.6T interconnect validation for AI infrastructure at OFC 2026. Infraeo, an industry leader of high-performance...
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205VIAVI Launches Observer Threat Forensics for NetSecOps with Advanced Retrospective Analysis
Creates unified view of the organization, eliminates noise or data gaps, and allows retrospective analysisacross network, application and user domains VIAVI Solutions...
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215Exxelia busbars now manufactured in an AS9100D and ISO 9001:2015 certified facility
Exxelia announces that its SVM production site is now certified to AS9100D and ISO 9001:2015, following a successful audit conducted by DNV...
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407OpenLight and TFC Advance Silicon Photonics Back‑End Integration Supporting up to 400G Data Rates on TGV Substrate
New evaluation board for a 400G EAM, based on OpenLight’s heterogeneous integration of InP-on-Si process, is available for testing, and includes a...
