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Silanna Semiconductor Showcases Best-in-Class Power Management Solutions at APEC 2023

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Silanna Semiconductor will demonstrate leading CO2 Smart Power™ families of advanced Fully-Integrated ACF controllers and high-frequency DC/DC converters at the Applied Power Electronics Conference (APEC)

Silanna Semiconductor, The Power Density Leader, today announced that it will showcase its full portfolio of AC/DC and DC/DC products that offer leading power density, efficiency and performance at the upcoming Applied Power Electronics Conference (APEC).

Silanna Semiconductor, with its family of CO2 Smart Power™ technologies of advanced, fully-integrated ACF controllers and high-frequency DC/DC converters, offers power management technologies that focus on the ultimate power management challenges, deliver unprecedented BoM savings and benefit the planet and the people on it by delivering best-in-class power density and efficiency. The company’s end-to-end power solutions are driving key innovations in travel adapters, laptop adapters, appliance power, smart metering, computing, lighting, industrial power, and display power using the latest digital and analog control and device technologies.

APEC 2023 will take place from March 19th to March 23rd at the Orange County Convention Center in Orlando, Florida. The event will include an exhibition and technical conference featuring keynotes, panel discussions, technical presentations and tutorials about major technical trends, market requirements, and new application areas. Silanna Semiconductor is an APEC sponsor and as part of its involvement in the event will be supporting a fast-charging station to help visitors quickly re-charge their mobile devices.

“We are looking forward to returning to APEC this year to demonstrate the huge advances in power density and efficiency in our expanded product portfolio,” said Mark Drucker, CEO of Silanna Semiconductor. “In addition to our leading products, we have created a series of reference designs for fast chargers with multiple ports and our easy-to-use Power Density Hero tool, we have made the design process even easier, helping OEMs to further minimize prototyping and testing times, make better use of internal resources and accelerate time-to-market for their next-generation products.”

Silanna Semiconductor will showcase the latest expansion of the company’s CO2 Smart Power product portfolio including AC/DC products such as the SZ1131 fully-integrated high-efficiency ACF controller, high-frequency DC/DC buck converters, power SIP and the innovative AnyPort™ architecture, which simplifies the development of multi-port products. Silanna Semiconductor’s new reference designs will be showcased by their GaN partners, Innoscience (Booth: 310) and Transphorm (Booth: 853) on the exhibition floor at APEC from March 20th-22nd. Visitors will also be able to experience Power Density Hero –  a power management design tool that provides engineers an optimized design schematic and full ‘Bill of Materials’ for all components – and an extensive power management Reference Design Library.

More details about APEC 2023 can be found at: https://apec-conf.org/

More information is available at https://www.powerdensity.com or to arrange an APEC meeting contact sales@silanna.com

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