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Empower Semiconductor to Present at Chiplet Summit 2024 on Eliminating External Regulators in Chiplet Architectures

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Multi-phase and multi-rail Integrated Voltage Regulators (IVRs) bring performance, scalability and footprint reduction to chiplet-based multicore systems

Empower Semiconductor, the world leader in integrated voltage regulators (IVRs), will present a technical paper on the benefits of IVRs at the upcoming Chiplet Summit, taking place at the Santa Clara Convention Center, February 6-8, 2024. Trey Roessig, Empower’s CTO and SVP of engineering, will discuss “Using Integrated Voltage Regulators in Chiplet Design,” on Wednesday, February 7, at 3:15 p.m. PST, as part of the design/security track.

Empower IVRTM technology features a novel and advanced power management architecture that delivers power with simplicity, speed and accuracy in a compact single IC with no external discrete components. These devices can be used for traditional system power in space-constrained applications as well as integrated as a power chiplet into an SoC or chiplet-based architecture. Combined with Empower’s E-CAP™ silicon capacitor products, in-package integrated voltage regulators achieve an unprecedented level of compactness, performance and power integrity.

Power delivery challenges have been exacerbated by the proliferation of chiplet-based multicore designs. The disparate nature of chiplets typically commands various power domains, often with their own unique requirements, making power conversion design a large contributor to the solution footprint. Empower Semiconductor’s presentation will examine how high-frequency IVRs can now integrate inside a package as a power chiplet, eliminating most external power converters and bulky inductors. This approach simplifies package design by removing multiple dedicated power balls and external traces, which reduces transmission losses and improves transient performance.

“Our IVRs not only increase the overall performance of chiplet-based devices, they also greatly simplify the implementation of the multiple power domains required. We save critical board space and power engineers are surprised at how seamless and flexible designing in-package power conversion is,” said Roessig. “We are excited to present the unique benefits of the Empower IVR technology at the upcoming Chiplet Summit.”

Visit www.chipletsummit.com to find out more about the event. To learn more about Empower Semiconductor’s solutions, visit www.empowersemi.com.

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