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802Top 10 NewsPICMG COM-HPC Mini working group reaches key milestone in record time
COM-HPC Mini pinout and footprint defined PICMG, a leading consortium for the development of open embedded computing specifications, announces that the COM-HPC...
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1.4KAutomotiveSTMicroelectronics boosts EV performance and driving range with new silicon-carbide power modules
Hyundai Motor Company has chosen ST’s highly efficient ACEPACK DRIVE power modules for multiple models of its E-GMP vehicle platform STMicroelectronics (NYSE:...
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689Test & MeasurementRohde & Schwarz and Löhnert Elektronik present a robot-based solution for end-of-line measurement of automotive radomes and bumpers
Together with its partner Löhnert Elektronik, Rohde & Schwarz has introduced a fully automated turnkey solution for bumper production radar transparency testing...
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767TMETECHMASTEREVENT – PORTAL THAT OFFERS USERS SPACE POSSIBILITIES
The TechMasterEvent platform has only been active for a year. During this time, it announced 8 thematic competitions addressed to young artists...
April Magazine
