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1.2KSTMicroelectronicsSTMicroelectronics Launches Next-Gen Payment System-on-Chip with Increased Performance and Protection
STMicroelectronics has released the next generation of its STPay system-on-chip (SoC) payment solution, leveraging state-of-the-art technology to increase contactless performance and protection,...
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1.2KElectronics ComponentThree New Automotive Grade IHLP® Inductors in Its Smallest 1212 Case Size
For Under the Hood Applications, AEC-Q200 Qualified Devices Feature Operating Temperatures as High as +155 °C and Profiles as Low as 1.0...
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1.6KMouserNew eBook from Mouser Electronics and Molex Highlights Next-Generation Connectivity Solutions for Industry 4.0
Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, announces a new eBook in collaboration with Molex that explores the...
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1.1KElectronics ComponentNew Screwless Terminal Blocks Ideal for High Temperature Operation
CUI Devices’ Interconnect Group today announced the addition of screwless terminal block connectors for high temperature applications. Featuring wide -40 to +130°C...
Aug Magazine
