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221ROHM SemiconductorROHM launches New Top-Side Cooling Package for SiCMOSFETs
ROHM has developed the TSC3PAK(14.00 × 18.58 × 3.50mm) package for SiC MOSFETs. By adopting a top-side heat dissipation structure that places...
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232Top 10 NewsTeledyne FLIR OEM Launches Boson SX8, the First NDAA-Compliant 8 µm SXGA LWIR Thermal Camera Module
The 1280 × 1024 Boson SX8 and Boson SX8-CZ 15–75 deliver optimized size, weight, and power with high-performance thermal imaging Teledyne FLIR...
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221Top 10 NewsLTE Cat.1 5 Click provides 4G LTE Cat 1 bis cellular connectivity for European IoT and M2M applications
Add 4G LTE Cat 1 bis connectivity where reliable data transmission and low power consumption are critical with the GC02S1-EU2 module LTE...
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204Electronics ComponentNavitas Introduces Isolated Through-HolePackage for SiCMOSFETs
Direct-cooled thermal management offered by a reflow-compatible, isolated thermal pad significantly improves power density, reliability, and efficiency. Integrated aluminum nitride substrate-based isolation...
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