Electronics Component

STMicroelectronics launches low-power, high performance STM32L4 MCU series


STMicroelectronics has introduced the development ecosystem for its latest low-power, high performance STM32L4 microcontrollers (MCU) and expanded the series with five new product lines comprising a range of package and memory-density options.

The expanded STM32L4 ecosystem builds on ST’s free and easy-to-use STM32Cube platform. This comprises the STM32CubeMX initialization-code generator and configurator with easy-to-use power estimation for ultra-low power design, and the STM32CubeL4 package that contains middleware components, Nucleo-32 Board-Support Package (BSP), Hardware Abstraction Layer (HAL), and Low-Layer APIs (LLAPIs).

Five new STM32L43x and STM32L44x MCU product lines comprise variants with versatile combinations of an integrated USB controller, an LCD controller, and cryptography for security-conscious applications. Up to 256KByte of Flash and low-pin-count-package choices make them ideal for cost-sensitive applications. The new devices also offer rich digital peripherals including a True Random-Number Generator (TRNG) and smart analog features such as a 12-bit 5Msample/s ADC, internal voltage reference, and ultra-low-power comparators.

All devices deliver the advantages of ST’s innovative low-power technology, which includes FlexPowerControl (FPC) with features such as separate supply-voltage domains for gating power individually to analog peripherals, USB circuits, and I/Os. Batch-Acquisition Mode (BAM) enables energy-efficient data capture and seven reduced-power modes with further sub-modes maximize energy savings in a wide range of operating conditions.

ST’s low-power technologies, combined with the performance of the 32-bit ARM Cortex-M4F core, ensure high efficiency according to EEMBC ULPBench tests. The STM32L433 is certified at 177 ULPMark-CP at 3.0V, tested without the aid of a step-down converter. Aided by ST’s innovative ART Accelerator, outright performance is also high at 273 CoreMark.

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