Latest Electronics Components News
Here you can read latest electronics components news through which you can get to know about latest invention in electronics such as electrical switches, electrical cables, electric motors, Batteries & Charge Storage Devices, Electronic Connectors, Electrical Panel, adaptors etc.
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287Vishay Launches Compact 1.5 kV IHDV Inductors for Automotive Applications
Devices Deliver Over 1 kΩ Impedance to Filter Noise Above 10 MHz, Soft Saturation for Stable Inductance, +180 °C Continuous Operation, and...
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323Vishay Launches Gen 7 1200V Hyperfast Rectifiers in SMPC HV Package
Reducing Switching Losses and Increasing Efficiency, Devices Combine Low Qrr Down to 105 nC and VF Down to 1.45 V With Low...
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360Littelfuse NANO² 708 Series Fuse Enhances 48V AI Data Center Protection
Industry-first 14 kA interrupting rating at 80 VDC in a compact surface-mount package Littelfuse, Inc. (NASDAQ: LFUS), an industrial technology manufacturing company...
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329Qorvo Unveils Compact X-Band Radar Front-End Module for Enhanced Performance
Qorvo® (Nasdaq: QRVO), a leading global provider of connectivity and power solutions, today introduced an X-band radar front-end solution that enables defense...
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294Nexperia Expands 650V GaN FET Portfolio with New RDS(on) Options
Comprehensive 650 V GaN portfolio enables flexible, high-efficiency system design across industrial applications Nexperia today announced the expanded portfolio of 650 V industrial-grade...
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297MIKROE Launches Spatial Anchor R1 & S1 for Apple Vision Pro
Compact tracking devices that support high-precision, real-time object tracking with Apple Vision Pro. MIKROE, the embedded solutions company, today announced two spatial...
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318QSiC Dual3 Modules Expand for AI Data Center Power Systems
Half-bridge series for data center power converters and industrial motor drives features low RDSonSiC MOSFETs and parallel SBD diodes for best-in-class power...
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278Nexperia Launches QDPAK-Packaged 1200V SiC MOSFETs to Eliminate Thermal Bottlenecks in High-Power Applications
Top-side cooled SMD package provides a practical route to higher power density and system efficiency while simplifying heatsink and mechanical integration Nexperia...
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290Navitas Introduces Isolated Through-HolePackage for SiCMOSFETs
Direct-cooled thermal management offered by a reflow-compatible, isolated thermal pad significantly improves power density, reliability, and efficiency. Integrated aluminum nitride substrate-based isolation...
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326Qorvo® Simplifies RF Control with SOI Portfolio that Eliminates Negative Bias
Qorvo® (Nasdaq: QRVO), a leading global provider of connectivity and power solutions, today announced a new portfolio of silicon-on-insulator (SOI) RF switches...
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