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Submounts Enable Next-Generation Thermal, Optical, and RF Packaging Vishay Intertechnology, Inc. (NYSE: VSH) today announced its new thin film submount platform, designed...
Continues roll out of development tool support agreement MIKROE, the embedded solutions company thatdramatically cuts development time by providing innovative hardwareand software...
GigaDevice, a leading global supplier of semiconductor devices, today announced the official launch of the GD32F5HC series 32 bit general purpose microcontrollers....
Featuring a Low 0.88 mm Profile and Wettable Flanks, Commercial and Automotive Grade Devices Provide Improved Thermal Performance and Efficiency Vishay Intertechnology,...
MEMS Thermal Conductivity Sensors Deliver 10x Faster Response, 0 % to 100 % Measurement Range, and More Than 15 Years of Service...
New gold-plated, washable DIP switches enable high-density PCB layouts in space-constrained designs Littelfuse, Inc. (NASDAQ: LFUS), an industrial technology manufacturing company shaping...
Device Offers DCR Down to 8.6 mΩ and Rated Current to 14.3 A in 3.0 mm x 3.0 mm Footprint With 1.2...
Panasonic Industry launches new fiber amplifier with practical features Panasonic Industry Europe is introducing the new FX 250 digital fiber sensor designed...
Silanna UV, a global innovator in ultraviolet semiconductor technology, today announced the release of an additional package type: a TO-39 flat window...
Analog innovator counters huge price increases from ‘major name’ suppliers – delivers predictable costs in an unpredictable market Silanna Semiconductor, a global...
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