TE Connectivity Announced ELCON Micro Wire-to-Board Power Solutions


TE Connectivity (TE), a world leader in connectivity and sensors, manufactures ELCON Micro wire-to-board power solutions, which provide a high current up to 12.5A per pin in the standard industry footprint of 3.0mm. A standard footprint allows for easy upgrades to existing designs and makes our headers and cable plugs footprint-compatible with other suppliers. Custom cable assemblies round out our high current portfolio and provide design flexibility.

TE’s ELCON Micro wire-to-board power solutions provide high current at 12.5A per pin in the common industry footprint of 3.0mm (contact pitch) and support different currents with multiple combinations of different wire sizes and 2 to 24 pin configurations. A common industry footprint allows for easy upgrades to existing designs. PCB footprint compatible with other suppliers. Virtually fool-proof mating makes assembly easy for the customer. It performs reliably in harsh environments with maximum operating temperature of 105°C and halogen-free material. New cable plugs and custom cable assemblies provide added design flexibility.

As an authorized distributor for TE Connectivity, Heilind Asia provides TE’s products and also value added services. Heilind Asia supports both original equipment and contract manufacturers in all market segments of the electronics industry, stocking products from the industry’s leading manufacturers in 25 component categories, with a particular focus on interconnect, electromechanical, fastener/hardware and sensor products.

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