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TE Connectivity Announced Digital Micromirror Device (DMD) 257 Socket

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TE Connectivity (TE)’s new DMD 257 socket provides a reliable solution for the new generation of Texas Instruments (TI) DMD chipsets. The DMD 257 socket offers increased reliability with an anti- hook contact design that can protect the terminal from damage during the operation process. The lower loading force of the contact can minimize the risk of the chipset being cracked, which supports easier mounting operation. As a proven socket technology provider, TE is a dependable socket partner for this and future chipset designs.

TE’s DMD 257 socket can be used for TI’s latest DMD chipset, the s410 system with 5.4 micron micromirror pitch. It offers increased reliability with an anti- hook contact design that helps protect the terminal from damage during the operation process and ensures the chip is mounted securely. The lower loading force of the contact can minimize the risk of the chipset being cracked, which supports easier mounting operation. TE continues to develop cutting edge socket solutions with fast turnaround time for prototypes and mass production. As a proven socket technology provider, TE is a dependable socket partner for this and future chipset designs.

As an authorized distributor for TE Connectivity, Heilind Asia provides TE’s products and also value added services. Heilind Asia supports both original equipment and contract manufacturers in all market segments of the electronics industry, stocking products from the industry’s leading manufacturers in 25 component categories, with a particular focus on interconnect, electromechanical, fastener/hardware and sensor products.

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