Infraeo, an industry leader of high-performance interconnect solutions for AI infrastructure and hyperscale data centers, will showcase several next-generation connectivity solutions in collaboration with VIAVI Solutions at OFC 2026 in the Los Angeles Convention Center.

At the VIAVI’s booth #1239, Infraeo solutions will be featured as part of high-speed networking and validation environments supporting the industry’s transition to 800G and 1.6T connectivity.

The joint demo includes Infraeo’s 1.6T OSFP Active Electrical Cable (AEC) and 800G QSFP-DD AEC, designed to support next-generation high-bandwidth interconnects for AI clusters, hyperscale data centers, and high-performance computing platforms. These demonstrations will be validated using VIAVI’s latest high-performance test and measurement platforms, ensuring line-rate performance and power efficiency for interconnects used in next-generation AI fabrics and data center architectures. VIAVI’s focus on open, multi-vendor interoperability underscores the importance of lab-to-field validation to confidently scale 800G and 1.6T deployments.

Infraeo will also highlight its 400G QSFP112 LPO SR4 transceiver, a low-power optical module designed to deliver high-performance connectivity while reducing power consumption in next-generation data center networks.

“Interoperability and validation across the ecosystem are critical as the industry moves toward 800G and 1.6T connectivity,” said Rakesh Sambaraju, EVP at Infraeo. “Working with industry-leading test equipment partners like VIAVI allows us to ensure our solutions are ready for real-world AI and hyperscale deployments.”

“As the industry accelerates toward 800G, 1.6T, and AI-scale network architectures, the ability to validate performance, latency, and power efficiency across a diverse ecosystem is critical,” said Aniket Khosla, VP of Product Management at VIAVI.

“VIAVI’s high-speed Ethernet test solutions are designed to give customers the confidence to deploy at scale. We’re proud to collaborate with Infraeo at OFC to demonstrate real-world interoperability of their interconnects and the rigorous test workflows required to move innovation from the lab to the live network.”

Through collaboration with ecosystem partners such as VIAVI, Infraeo continues to support interoperability testing and system validation for emerging high-speed networking technologies.

Visitors to OFC 2026 can see the demonstrations at VIAVI’s booth #1239 or learn more about Infraeo’s portfolio of 800G and 1.6T connectivity solutions at Infraeo’s booth #5033.