Direct-cooled thermal management offered by a reflow-compatible, isolated thermal pad significantly improves power density, reliability, and efficiency. Integrated aluminum nitride substrate-based isolation...
See the QSiC™Gen3 line, now offering high-thermal-performance options featuring AlN substrates and pre-applied TIM, on display at Booth #110 in Hall 4A...
Highlights include two SST solutions for converting the MV grid to 800V HV DC,a 10 kW, 800V-to-50V DC-DC full-brick platform, along with...
Surface-Mount Device Features a Robust Nanocrystalline Core and Overmolded, Ruggedized Construction for Reliable Performance in Harsh Environments Vishay Intertechnology, Inc. (NYSE: VSH)...
QSiC™Gen3 line featuring 1200V SOT-227, S3 half-bridge, B2T1 six-pack and B3 full-bridge packages on display at Booth #1451 SemiQ Inc, a designer,...
Family includes 608 A half-bridge module with 2.4 mΩ RDSon and best-in-class thermal resistance SemiQ Inc, a designer, developer, and global supplier...
Navitas Semiconductor Corporation (Nasdaq: NVTS), the industry leader in next-generation GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide (SiC) power semiconductors and...
First-in-industry low-side gate driver with adjustable negative gate drive bias offers safer operation, reduced component count, and increased power density for EV...
Navitas unveils new 100 V GaN FETs, alongside 650 V GaN and high voltage SiC devices, purpose-built for NVIDIA’s 800 VDC AI...
As electronic product architectures diversify, engineers are encountering unprecedented challenges in component selection. Today’s designs must not only meet demanding technical criteria...