ROHM Semiconductor Europe will return to electronica 2026, taking place from 10 to 13 November 2026 in Munich, Germany. Visitors can meet...
Solution combines digital power control, GaN technology, and hardware-based security to accelerate development of high-efficiency rack power systemsbased on the 800V DC...
ROHM Semiconductor announces that its innovative power semiconductor solutions are being utilized in electric vehicle platforms from a leading global premium automotive...
Joint evaluation of GaN and SiC technologies aims to unlock higher efficiency and more compact power electronics for automotive applications. Nexperia* today...
ROHM will exhibit at electronica India 2026, South Asia’s leading trade fair for electronic components, systems, applications, and solutions, from September 16th...
License agreement provides Magnachip access to Navitas’ GeneSiC™ Gen 4 and Gen 5 SiC technologies spanning 1200 V, 2300 V, 3300 V...
Direct-cooled thermal management offered by a reflow-compatible, isolated thermal pad significantly improves power density, reliability, and efficiency. Integrated aluminum nitride substrate-based isolation...
See the QSiC™Gen3 line, now offering high-thermal-performance options featuring AlN substrates and pre-applied TIM, on display at Booth #110 in Hall 4A...
Highlights include two SST solutions for converting the MV grid to 800V HV DC,a 10 kW, 800V-to-50V DC-DC full-brick platform, along with...