Semiconductor Packaging -techmezine

c touch display shenzhen 2026 global buyers

C-TOUCH & DISPLAY SHENZHEN 2026 to Welcome Global Buyers from October 27

With about one month to go, C-TOUCH & DISPLAY SHENZHEN 2026 is on course to welcome its largest international audience to date....

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EMS

ASMPT at SEMICON Taiwan

Strengthening Advanced Packaging Innovation and Engagement in Taiwan Global technology and innovation leader ASMPT will showcase its advanced packaging portfolio at SEMICON...

Saras Micro Devices expands leadership to support advanced packaging technology and customer growth

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Top 10 News

Saras Micro Devices Strengthens Leadership to Drive Advanced Packaging Growth

Saras Micro Devices, an emerging leader in cutting-edge power performance solutions leveraging integrated packaging design, today announced the expansion of its senior...

ASMPT exhibiting advanced semiconductor manufacturing

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EMS

ASMPT Showcases Advanced Semiconductor and Electronics Manufacturing Solutions at NEPCON Thailand 2026

A first for Thailand: SIPLACE V ushers in a new era of SMT manufacturing ASMPT, a global market and technology leader in...

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Electronics Component

Nexperia Launches QDPAK-Packaged 1200V SiC MOSFETs to Eliminate Thermal Bottlenecks in High-Power Applications

Top-side cooled SMD package provides a practical route to higher power density and system efficiency while simplifying heatsink and mechanical integration Nexperia...