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795Technologycongatec introduces high-performance COM-HPC carrier board in Micro-ATX form factor
Modular high-end Micro-ATX carrier for more sustainable and ultra-scalable COM-HPC based system designs congatec – a leading vendor of embedded and edge...
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834Electronics ComponentVishay Intertechnology IHDM Edge-Wound Inductors
Featuring Powdered Iron Alloy Core Technology and Soft Saturation, Through-Hole Devices Provide Low DCR to Reduce Power Losses and Increase Efficiency Vishay...
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962Electronics ComponentiWave launches the Zynq® UltraScale+™ RFSoC System on Module with ZU49/ZU39/ZU29
iWave Systems is pleased to announce the Zynq UltraScale+ RFSoC System on Module. The SOM features the ZU49DR, and compatible with the...
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1.1KElectronics ComponentHalo Microelectronics’ 2:1 Charge Pump Direct Charger IC Powers Samsung’s Galaxy A23 Smartphones
Halo Microelectronics (SSE: 688173), a maker of analog and power management integrated circuits enabling energy-efficient smart systems, announced that its HL7132, a...
Jan Magazine
