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809InfineonInfineon QDPAK and DDPAK top-side cooling packages registered as JEDEC standard for high-power applications
The trends toward higher power density and cost optimization dominate the development goals of efficient high-power applications that create substantial value for...
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758Top 10 Newsonsemi Commemorates Transfer of Ownership of East Fishkill, New York Facility from GlobalFoundries with Ribbon Cutting Ceremony
Acquisition and investments planned for ramp-up at the East Fishkill (EFK) fab create onsemi’s largest U.S. manufacturing site EFK enables accelerated growth...
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559Top 10 Newscongatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem * * * congatec – a leading vendor of embedded and edge computing technology –...
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660Top 10 NewsMacDermid Alpha showcases solutions for automotive applications, 5G infrastructure, mobile devices, film, and surface finishing technologies at Source India
MacDermid Alpha, one of the world’s largest providers of solutions for circuitry, assembly, and semiconductor manufacturers within the electronics industry, will showcase...
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