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569Top 10 NewsTeledyne FLIR OEM Launches Lepton XDS at Mobile World Congress; A Compact Thermal‑Visible Camera Module Featuring Patented MSX Technology
Prism™ ISP–Powered Dual Camera Module Delivers Enhanced Performance and Faster Integration for OEMs Teledyne FLIR OEM, a part of Teledyne Technologies Incorporated...
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364STMicroelectronicsNanoXplore and STMicroelectronics deliver European FPGA for space missions
NanoXplore’s NG-ULTRA FPGA becomes the first product qualified to new European ESCC 9030 standard for space applications The product leverages a supply...
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351Top 10 NewsHARMAN Embedded Audio Showcases Connected Device Innovation at Mobile World Congress 2026
HARMAN Embedded Audio (HEA), a leading end‑to‑end B2B embedded audio solutions provider, announced it will showcase how global brands can differentiate connected...
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310RenesasRenesas R-Car V4H ADAS SoC Selected for Toyota RAV4 Model
Renesas ADAS automotive SoC, R-Car V4H has been selected for the TSS(LSS) control unit supplied by Denso for Toyota’s new RAV4 model...
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