Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the expansion of its CoolSiC 1200 V and 2000 V MOSFET module...
Vicor’s Powering Innovation podcast discusses the proliferation of ROV applications and how VideoRay is responding to new underwater missions Vicor Corporation,...
Anritsu Corporation, in collaborating with the University of Texas at Dallas, showcases the OpenROADM[*1] at the Supercomputing Conference 23 (SC23) on November 12-17,...
WIRE-TO-WIRE CAPABILITY Ultra-Fit Tangless connector is a wire-to-board and wire-to-wire system that offers a 3.50mm pitch, a higher current rating of 14.0A,...