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476Top 10 NewsLegrand India Launches its 17th Experiential Centre, Innoval in Goa
Innoval to house all Legrand’s products and solutions under one roof brings the range of connected devices to the customers Defines the...
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584InfineonInfineon QDPAK and DDPAK top-side cooling packages registered as JEDEC standard for high-power applications
The trends toward higher power density and cost optimization dominate the development goals of efficient high-power applications that create substantial value for...
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516Top 10 Newsonsemi Commemorates Transfer of Ownership of East Fishkill, New York Facility from GlobalFoundries with Ribbon Cutting Ceremony
Acquisition and investments planned for ramp-up at the East Fishkill (EFK) fab create onsemi’s largest U.S. manufacturing site EFK enables accelerated growth...
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375Top 10 Newscongatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem * * * congatec – a leading vendor of embedded and edge computing technology –...
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