Latest News
-
672Top 10 NewsVishay Intertechnology Adds Pick and Place Friendly SMD Lead Bending Option for AC05 and AC05-AT 5 W Cemented, Axial-Leaded Wirewound Resistors
WSZ Lead Form Allows Devices to Be Used as SMD Components to Reduce Assembly Costs Vishay Intertechnology, Inc. (NYSE: VSH) today announced...
-
770Test & MeasurementSaelig Debuts Intona 7055 Series USB 2.0/3.0 Isolators With ESD Protection
Compliant to USB 2.0 High-Speed 480Mbps and USB 3.0 SuperSpeed 5Gbps the 7055’s isolation is designed to withstand up to 5kVRMS, as...
-
523STMicroelectronicsNew wireless-charging boards from STMicroelectronics
Development board combination with 50W transmitter and receiver simplifies fast charging utilizing ST Super Charge protocol STMicroelectronics has introduced a 50W, Qi-compatible...
-
612Top 10 NewsREVOLUTIONARY FLIP-CHIP DIE BONDER FROM ITEC IS 5X FASTER THAN CURRENT MARKET LEADERS
ITEC introduces the ADAT3 XF TwinRevolve flip-chip die bonder, which runs five times faster than existing machines, attaching up to 60,000 flip-chip...
March Magazine
