Compliant to USB 2.0 High-Speed 480Mbps and USB 3.0 SuperSpeed 5Gbps the 7055’s isolation is designed to withstand up to 5kVRMS, as...
Development board combination with 50W transmitter and receiver simplifies fast charging utilizing ST Super Charge protocol STMicroelectronics has introduced a 50W, Qi-compatible...
ITEC introduces the ADAT3 XF TwinRevolve flip-chip die bonder, which runs five times faster than existing machines, attaching up to 60,000 flip-chip...
Cepsa, one of Spain’s largest integrated energy companies, operates two energy parks in the south of Spain. For years, employees at the...