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214Electronics ComponentVishay Intertechnology AEC-Q200 Qualified Thick Film Power Resistor
Offered in Clip-Mount TO-247 Package for Direct Mounting on a Heatsink, Device Combines High Pulse Absorption to 75 J/0.1 s With Power...
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220EMSASMPT demonstrates technology leadership in SMT assembly
Zero DPMO – in every dimension The rapid development of artificial intelligence is driving the demand for high-performance processors and placing great...
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250Top 10 NewsNavitas &GigaDevice Announce Partnership to Combine Power & Control
Joint lab collaboration expected to accelerate GaN&SiC adoption in AI data centers, EV, solar and energy storage systems (ESS) Navitas Semiconductor (Nasdaq:...
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211Top 10 NewsNexperia introduces new high speed optimized flip-chip package technology
New flip-chip land grid array (FC-LGA) packages deliver superior RF performance and meet automotive quality with industry’s first side-wettable flank versions Nexperia...
May Magazine
