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199ROHM SemiconductorROHM Develops New HighPower Density SiC Power Modules
Compact high heat dissipation design sets a new standard for OBCs ROHM has developed the new 4-in-1 and 6-in-1 SiC molded modules...
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193Digi-KeyDigiKey Adds Nearly 100,000 NPIs and More Than 100 New Suppliers in First Quarter of 2025
DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment,is proud...
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517In TalksWe want to increase reach and tap unaddressed market.
Interviewee : Manish Joshi, Country Manager of Siglent Technologies CO. Ltd Q 1) Tell us about Siglent’s journey in India. We have...
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203Electronics ComponentVishay Intertechnology Thick Film Power Resistor With Optional NTC Thermistor and PC-TIM
AEC-Q200 Qualified Device in Compact SOT-227B Package Offers High Pulse Handling Capability and Power Dissipation to 200 W Vishay Intertechnology, Inc. (NYSE:...
May Magazine
