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439Electronics ComponentVishay Intertechnology 150 V MOSFET
Offered in PowerPAK® SO-8S Package, TrenchFET® Device’s Low RthJC of 0.45 °C/W Enables High ID to 144 A to Increase Power Density...
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509Top 10 NewsKeysight Introduces Electronic Design Automation Software Suite Amplifying Designer Productivity with AI
Reduces Radio Frequency (RF) device modeling time from days to hours Automated Python work flows streamline design processes Accelerates predictive design of...
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395STMicroelectronicsSTMicroelectronics’ STGAP3S advanced galvanically isolated gate drivers feature flexible protection for IGBTs and SiC MOSFETs
Targeting industrial and energy applications with motor drives for air conditioning, home appliances and factory automation, as well as power control in...
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501Top 10 NewsHighly flexible die and flip-chip bonder for co-packaged optics production
AMICRA NANO – Hybrid bonding for data highways The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the...
Jan Magazine
