SIM (Subscriber Identity Module) and UIM (Universal Identity Module) cards are widely used in a variety of mobile applications, including, billing, security...
TE Connectivity’s (TE) Z-PACK HM-ZD connector portfolio provides data rates of up to 56 Gbps while retaining backwards compatibility with previous versions...
TE Connectivity’s (TE) modular jacks with integrated magnetics offer a highly integrated connectivity solution from the cable to the physical layer for...
Kyocera’s innovative mmWave phased array antenna module (PAAM) generates multiple simultaneous beams in different directions and frequencies, enabling a wide range of...