Enable high efficiency power conversion in energy-intensive AI server farms Nexperia today announced the addition of two 1200 V 20 A silicon...
ROHM has announced the release of new Level 3 (L3) SPICE models that deliver significantly improved convergence and faster simulation performance. Since...
New Devices from MCU Leader Meet Demands for Performance and Compact Size; Offer Peripheral Set Targeted for Motor Control Renesas Electronics Corporation...
Offered in the Compact SlimSMA HV (DO-221AC) Package, 1 A and 2 A Devices Offer Low Capacitive Charge and High Minimum Creepage...