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477Top 10 NewsNEPCON JAPAN [September] 2025 Opens September 17, Set to Showcase 300 Exhibitors
With only days to go, preparations are underway for NEPCON JAPAN [September] 2025, taking place from September 17–19 at Makuhari Messe. Known...
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414EMSASMPT Joins “JOINT3” Consortium to Develop Next-Generation Semiconductor Packaging
Global Advanced Packaging Leader Brings Proven Thermo-Compression Bonding Expertise to Next-Generation Panel-Level Innovation Platform ASMPT Limited (ASMPT), a leading global supplier of...
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311Top 10 NewsCADFEM India and IIT Roorkee Launch Pioneering Digital Twin Lab to Advance Simulation-Led Innovation
Partnership brings Ansys (now a part of Synopsys) Multiphysics tools and CADFEM expertise to empower research, curriculum, and skill development. IIT Roorkee’s...
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363Top 10 NewsTeledyne FLIR OEM Launches Boson+ IQ Thermal Imaging Development Kit at DSEI UK 2025
New Hardware and Software Development Kit Accelerates Thermal Imaging and AI Integration at the Edge. Teledyne FLIR OEM, part of Teledyne Technologies...
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