Electronics Components

Bubbles bring better cooling for electronics devices, researchers claim


According to Engineers at Oregon State University from United States have sounded the most new ways to induce and control the boiling bubble formation that will be used in some potential applications for fooling the electronic devices in emerging Technologies.

According to their contact this technology can have many application filled and Science related to solar energy advanced laser Radar and other electronic equipment that meet beat level dissipation. The new approach uses piezoelectric inkjet printing to create hydrophobic polymer ‘dots’ on a substrate, on which a hydrophilic zinc oxide nanostructure is deposited.


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