EMS
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467ASMPT SMT Solutions and Shinwa launch cooperation at NEPCON Japan 2026
Strong partnership for innovative Advanced Packaging technologies With the shared objective of addressing the rapidly growing advanced packaging market through innovative, state-of-the-art...
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362ASMPT SEMI Solutions exhibits at NEPCON Japan
Advanced Packaging for next-gen AI chips ASMPT will be exhibiting at NEPCON Japan from January 21 to 23, 2026. At booth E32-1t...
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362ASMPT presents optimized Odd Shaped Component (OSC) Package
Mastering OSCs for maximum competitive advantage With the optimized SIPLACE OSC Package, technology and market leader ASMPT SMT Solutions is strengthening the...
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468Launch of the ASMPT SMT Customer Portal
Digital services centrally bundled for intelligent manufacturing ASMPT SMT Solutions has introduced its new ASMPT SMT Customer Portal. It serves as a...
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440ASMPT at productronica India
Transform your SMT production with ASMPT The hardware, software and Intelligent Factory concept presented by market and technology leader ASMPT drew strong...
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588ASMPT and KOKUSAI ELECTRIC Join Forces to Accelerate 2.5D and 3D Heterogeneous Integration Technology
ASMPT, the global leader in advanced packaging and assembly solutions, and KOKUSAI ELECTRIC CORPORATION, a pioneer in front-end semiconductor equipment, announced a...
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558ASMPT at SEMICON West 2025
Showcasing Advanced Packaging Solutions for AI and High-Performance Computing ASMPT, a global provider of advanced packaging and semiconductor assembly solutions, will participate...
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437ASMPT introduces ALSI LASER1206
Fully automatic laser dicing and grooving ASMPT Semiconductor Solutions launches the ALSI LASER1206, its latest system for bare wafer handling and separation...
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463ASMPT Announces Gordon Lam as Chief Commercial Officer for SEMI Solutions
Tech industry veteran brings extensive global leadership experience to accelerate commercial growth ASMPT Ltd (“the Group”), the world’s leading provider of integrated...
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529ASMPT Joins “JOINT3” Consortium to Develop Next-Generation Semiconductor Packaging
Global Advanced Packaging Leader Brings Proven Thermo-Compression Bonding Expertise to Next-Generation Panel-Level Innovation Platform ASMPT Limited (ASMPT), a leading global supplier of...
