Posts By Techmezine
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373AutomationHSYCO Expands Smart Building Integration with New Shelly Driver
Unlocking Smarter, More Connected Automation with Shelly Smart automation just got even smarter. HSYCO, a leader in integrated building management solutions, announces...
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720Top 10 NewsNavitas Partners with Great Wall for Next Generation 400V-DC Power Architecture for AI Data Centers
GaNSense™ technology boosts 8x power for AI data centers, telecommunications, and industrial equipment in ultra-high power density DC-DC converters. Navitas Semiconductor (Nasdaq:...
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481EVSemiQ supplies SiC MOSFET modules for integration into advanced EV battery cell cyclers
SemiQ Inc, a designer, developer, and global supplier of superior silicon carbide (SiC) solutions for ultra-efficient, high-performance, and high-voltage applications, has confirmed...
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552Test & MeasurementEmerson and Tata Elxsi Lead Industry Dialogue on AI’s Transformative Role in Test and Measurement
Joint event highlights how AI is transforming validation workflows across industries Emerson (NYSE: EMR) and Tata Elxsi co-hosted the Leadership Forum 2025,...
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595Top 10 NewsEU Invests €15M to Help Companies Supercharge Their Products with Light
New investment from the European Commission is helping innovators exploit the unique properties of light technologies to add smart features and improve...
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634Test & MeasurementKeysight Introduces AIData Center Builder to Validate and Optimize Network Architecture and HostDesign
Validates the performance of AI infrastructure by emulating real-world workloads Evaluate show new algorithms, components, and protocols improve the performance of AI...
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486Top 10 NewsShenglong Electric showcases two AI-powered products in OFC 2025 to redefine smart electricity use
(Pacific Standard Time), the world’s top optical communication event, the 50th Optical Fiber Communication Conference and Exhibition (OFC), opens at the Moscone Center...
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450Electronics ComponentVishay Intertechnology Releases AEC-Q100 Qualified RGBIR Color Sensor in Compact 2.67 mm x 2.45 mm x 0.6 mm Package
Automotive Grade Device Allows for the Calculation of Color Temperature, Light Source Differentiation, and Placement Behind Dark Cover Glass The Optoelectronics group...
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407Top 10 NewsAlliance Memory Launches New 32Mb Fast SRAM in 48-ball FBGA Package
Device Offers Wide Power Supply Range From 1.65V to 3.6V and Fast Access Time Down to 10 ns To meet the demand...
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447Top 10 NewsAdvanced Energy Announces2025STEM Scholarship Program Recipients
Students from Stanford University, University of Colorado, Boulder, and Colorado State University each receive a $20,000 scholarship grant, internship and professional mentoring...
