Posts By Techmezine
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572ArticleHigh power Schottky diodes from SMC
In today’s industrial electronics devices (power electronics devices), the key factors are efficiency, energy savings and miniaturization. Consumers expect, that the equipment...
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404ArticleIndustrial Connectors: How Innovations in High Reliability Ranges Drive Advances Throughout the Harwin Portfolio
The environment in which industrial and embedded systems operate has changed to become almost unrecognisable in recent years and the connectors developed...
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1.1KBlogWhy Zero Trust Architecture Is the New Cybersecurity Standard
Source : Mouser Electronics In the modern, everything-is-connected era, security isn’t just an issue for information technology (IT) and networking specialists but a...
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1.3KEMagazineAll About Electronics July Magazine 2025
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443Test & MeasurementNew updated edition of “PXIMate” reference guide for T&M engineers available from Pickering Interfaces
Latest edition of 92-page reference book provides overview of the standard and practical guide to using PXI Pickering Interfaces, the leading provider...
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523HeilindTE – Magnetic Modular Jacks
TE Connectivity’s (TE) modular jacks with integrated magnetics offer a highly integrated connectivity solution from the cable to the physical layer for...
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478HeilindTE – Z-Pack High-Speed Backplane Solutions
TE Connectivity’s (TE) Z-PACK HM-ZD connector portfolio provides data rates of up to 56 Gbps while retaining backwards compatibility with previous versions...
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506Top 10 NewsNearly two-thirds of organizations consider quantum computing as the most critical cybersecurity threat in 3–5 years
Six in ten ‘early adopters ’ of quantum-safe technologies predict that ‘Q-day ’, the point at which quantum computers can break current...
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498Electronics ComponentNexperia boosts wide-bandgap portfolio with 1200 V SiC Schottky diodes
Enable high efficiency power conversion in energy-intensive AI server farms Nexperia today announced the addition of two 1200 V 20 A silicon...
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358ROHM SemiconductorROHM Releases New Level 3SPICE Models Featuring Enhanced Simulation Speed
ROHM has announced the release of new Level 3 (L3) SPICE models that deliver significantly improved convergence and faster simulation performance. Since...
