Offered in PowerPAK® SO-8S Package, TrenchFET® Device’s Low RthJC of 0.45 °C/W Enables High ID to 144 A to Increase Power Density...
Reduces Radio Frequency (RF) device modeling time from days to hours Automated Python work flows streamline design processes Accelerates predictive design of...
Targeting industrial and energy applications with motor drives for air conditioning, home appliances and factory automation, as well as power control in...
AMICRA NANO – Hybrid bonding for data highways The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the...
New SXV, SXE, and SVPG series deliver superior durability, low ESR, high ripple current, and increased capacitance, setting a new standard for...
Hyperlux advanced imaging capabilities capture most accurate visual data to ensure error-free interpretation of driving environments and enhance car safety NEWS HIGHLIGHTS...
MediaTek, the world’s leading fabless semiconductor company, powering nearly 2 billion connected devices a year, showcased the company’s leadership in mobile, automotive...
SARA-R10001DE offers the ability to switch between networks for best coverage and cost with Wireless Logic’s connectivity solutions, emphasizing the strategic partnership...
Team secures first place for AI-Powered Indian Sign Language Translation Platform at Intel AI Global Impact Festival Team ‘Ishaara’ from K J...
Rankings by Revenue Places Kingston No. 1 with 68.8% Market Share Recognized World Leader for 21 Consecutive Years Kingston Technology, a world...