Fully automatic laser dicing and grooving

ASMPT Semiconductor Solutions launches the ALSI LASER1206, its latest system for bare wafer handling and separation under Class 1000 cleanroom conditions, at SEMICON Taiwan 2025. Under the theme “Empower the Intelligence Revolution,” the next-generation laser dicing and grooving platform will be showcased at Booth L0716, Level 4, TaiNEX 1 in Taipei from September 10 to 12. ALSI LASER1206 addresses the growing demand from semiconductor companies specializing in advanced packaging to deliver solutions for growth markets such as AI and smart mobility. This new system, featuring patented multi-beam laser processing technology, with fully automated film frame and bare wafer handling, expands the company’s portfolio with a focus on front-end processes.

The next-generation LASER platform has been specifically engineered to meet the increasingly complex requirements of IDM and Foundry semiconductor companies for laser dicing and grooving of wafers. This innovative system delivers precision and performance that is unparalleled in the industry, enabling processing of a wide range of semiconductor materials used in Advanced Memory, Logic, AI and Power applications. The patented UV laser technology achieves maximum precision with minimal heat impact, thereby reducing burr formation and die strength degradation. The device has an integrated wafer coating and cleaning station and offers numerous options for fully automated handling of film frames and bare wafers. The positioning accuracy of the planar motion system is < 1.5 μm. For grooving, wafers from 60 to 800 μm can be processed, while for dicing, the wafer thickness ranges from 20 to 200 μm.

“The new platform is our contribution to the hardware needs of the AI revolution. It combines high-precision laser processing with intelligent automation to support the next generation of semiconductor manufacturing”, says Patrick Huberts, Head of Business and Marketing at ASMPT ALSI. “It is the ideal platform for applications in advanced packaging, AI, and power automotive and mobile applications. And, not to forget, it is the top solution for preparing plasma dicing with maximum yield.”