Leading-Edge Packaging for Advanced Technologies

ASMPT,the world’s leading provider of hardware and software solutions for semiconductor and electronics manufacturing, will be exhibiting at SEMICON India (September 2-4, 2025) under the theme “Empower the Intelligence Revolution.” This refers to the fact that current developments in areas such as AI, smart mobility and hyper connectivity require chips and components for which ASMPT is the leading manufacturer of cutting-edge advanced packaging and semiconductor manufacturing technologies. The company will showcase two machines at booth 1223 of the Yashobhoomi (IICC) in New Delhi: the fine-pitch wire bonding solution AERO PRO and the ultra-fast die bonding solution INFINITE.

Fine-Pitch Wire Bonder First Time in India

ASMPT Semiconductor Solutions introduces its latest high-performance wire bonder: the AERO PRO. Developed for high-density semiconductor designs,this machine delivers the highest bonding accuracy and exceptional speed for wires with diameters of 0.5 mil (≈12.7 µm). Thanks to integrated real-time monitoring and preventive maintenance functions, the system is ideally suited for use in intelligent, networked production environments. To accommodate complex designs such as system-in-package (SiP) and multi-chip modules (MCMs) as well as applications like ball grid arrays (BGAs), land grid arrays (LGAs), memory modules or quad flat packages (QFPs) with external leads, the AERO PRO supports mixed-wire bonding. For uniform 22-µm bond balls, the AERO PRO employs the innovative and patented X-POWER 2.0 transducer, a newly developed lightweight and vibration-optimised ultrasonic transducer that transfers the energy with great precision in X and Y directions.Featuring real-time process monitoring and predictive maintenance, AERO PRO seamlessly integrates with automated material handling and manufacturing execution systems (MES) to enhance yield and operational efficiency.

With outstanding precision, reliability, repeatability, and intelligent automation capabilities, the AERO PRO is a premier solution designed to meet the rapidly evolving demands of AI edge devices and smart mobility applications.

Flagship Die Bonder

The second machine on the ASMPT booth is the die bonder INFINITE, which achieves top performance in throughput and quality with intelligent features, especially in adhesive application and placement. INFINITE is a universal, high-speed die bonder designed to meet the rigorous demands of sophisticated semiconductor packaging. Supporting a broad array of packaging formats such as BGA, LGA, SiP, MEMS, and QFN, it ensures consistent quality in producing AI chips, 5G modules, and HPC devices. Its intelligent iSense and iTouch features provide precise adhesive dispensing and force regulation, essential for the reliable packaging of safety-critical ADAS, LiDAR components, and SiC/GaN power modules used in electric vehicles. Moreover, INFINITE plays a critical role in assembling high-precision RF, photonics, and high-speed logic modules needed for advanced telecom infrastructure and hyperconnectivity solutions. This combination of precision, adaptability, and intelligent control makes INFINITE a key enabler of cutting-edge technologies driving the Intelligence Revolution.

Empowering the Intelligence Revolution

“We are delighted to present AERO PRO in India for the first time. Together with INFINITE, these solutions represent our advanced wire bonding and die bonding technologies, designed to integrate logic, memory, sensors, and photonics with high precision and efficiency to support India’s growing semiconductor ecosystem”, said Kenneth Koh, Head of Strategic Marketing at ASMPT Semiconductor Solutions.“At ASMPT SEMI solutions, we enable advanced, intelligence-driven innovations that enhance performance, promote miniaturisation, and improve energy efficiency across data centers, vehicles, and global networks—driving progress in AI, smart mobility, and hyperconnectivity.”