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266STMicroelectronicsSTMicroelectronics enters high-volume production of its industry-leading silicon photonics platform to support AI infrastructure demand
PIC100 technology in 300 mm high-volume production for leading hyperscalers, with plans to quadruple capacity by 2027 and further expand in 2028...
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554DigilentIntroducing the New soon to be Launched Digilent ADP2440 and ADP2450
High-Speed, High-Bandwidth Mixed Signal Oscilloscopes for Modern Engineering Workflows The Analog Discovery Pro 2400 Series expands Digilent’s professional test and measurement lineup with a...
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429Top 10 NewsOpenLight to Showcase Breakthrough III-V Heterogenous Integrated Silicon Photonics Innovations and Production Capabilities for AI, Cloud, and High Speed Networking at OFC 2026
OpenLight, a leader in heterogeneous III‑V silicon photonic integration and custom Photonic Application‑Specific Integrated Circuits (PASICs), will showcase multiple technology breakthroughs at...
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217Top 10 NewsFineX. Makes shielding clear.
Panasonic Industry launches high‑transparency, low‑resistance, flexible transparent conductive film for electromagnetic wave shield with pre‑applied OCA Panasonic Industry announces the release of FineX (“FineCross”),...
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225EVServotech & Electra EV Secure JointPatent for Low-Voltage Electric Vehicle Charging Device
Servotech Renewable Power System Ltd. (NSE: SERVOTECH),in collaboration with Electra EV, has been granted a patent by the Indian Patent Office for...
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188Test & MeasurementDDS option boosts flexibility of general-purpose AWGs
Spectrum Instrumentation has introduced a new Direct Digital Synthesis (DDS) option for its 65xx series Arbitrary Waveform Generators (AWGs), providing a highly...
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186RenesasRenesas Announces General Availability of Renesas 365
First open end-to-end electronics development platform unites device exploration, model-based system development, device lifecycle management and early concept validation in one unified...
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189Top 10 NewsSIMCom launches new compact, smart AI modules
AI core, MCU and Wi-Fi/Bluetooth connectivity in one 43 x 44 x 3.2mm module See SIMCom at Embedded Worldon Booth3-525,Messe Nürnberg,Nuremburg, Germany,...
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299MouserNow at Mouser: NXP Semiconductors’ IW610 Wi-Fi 6 Tri-Radio SoC Elevates Connectivity in IoT Applications
Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components™, is now...
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191Electronics ComponentSfera Labs Introduces M.2 LTE Module Expansion Board for Strato Pi Max
New X2-Series expansion board brings LTE cellular connectivity and GNSS positioning to the Strato Pi Max industrial server platform Sfera Labs has...
