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217EMSASMPT introduces pick &place systemDALA for all camera module components
Ideal Solution for Sensing and Imaging Applications ASMPT, a global leader in semiconductor and electronics manufacturing hardware and software, introduces DALA, its...
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229Electronics ComponentDanisense introduces new high precision DC and AC current clamp-on
High accuracy, exceptional phase-shift performance and high-frequency bandwidth Key points: Launch of new high precision DC and AC current clamp-on for galvanically...
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221RohdeRohde & Schwarz amplifiers enable high-field immunity testing expansion at IB Lenhardt Lab
IBL-Lab GmbH, the DAkkS (Deutsche Akkreditierungsstelle GmbH) accredited EMC test laboratory of IB-Lenhardt AG, has significantly expanded its high-field immunity testing capabilities...
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286Electronics ComponentPower Integrations Extends Flyback Topology to Enable 440 W, Offering Simpler Alternatives to Resonant Power Designs
New TOPSwitchGaN ICs more than double power output, reducing system cost, complexity, and design time Power Integrations (NASDAQ: POWI), the leader in...
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264Texas InstrumentsTI unveils high-performance isolated power modules to advance power density in data centers and EVs
New power modules with proprietary IsoShield™technology deliver industry-leading power density News highlights: IsoShield technology enables isolated power modules with up to three...
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2.5KRenesasRenesas’ New GaN Charging Solution Delivers 500W of Power to Wide Range of Industrial and IoT Electronics
GaN-Based HWLLC Converter Topology Sets New Power Density and Peak Efficiency Benchmarks for Next-Generation Computing Devices, Power Tools and e-Bikes Renesas Electronics...
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168RenesasRenesas Unveils First Bidirectional 650V-Class GaN Switch For Solar Power Inverters, AI Data Centers and More
First-of-its-kind bidirectional GaN technology with DC blocking dramatically reduces switch count needed for power conversion topologies Compatible with standard gate drivers Soft- and hard-switching capable,...
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177Electronics Component1200 V QSiC™ Dual3 Modules Enable Power Converters with Industry-Leading Conversion Efficiencyand Power Density
Half-bridge series for data center cooling and industrial drivers includes 1, 1.4 and 2 mΩ RDSonSiC MOSFETs and parallel SiC diodes for...
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102UncategorizedPhotonics research at heart of €370B European tech boom, new study finds
A major new study has revealed that Europe’s university spinout companies have grown into a technology ecosystem worth hundreds of billions of...
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234UncategorizedInfraeo to Showcase High Speed Connectivity Solutions with VIAVI Solutions at OFC 2026
Infraeo and VIAVI to demonstrate 800G and 1.6T interconnect validation for AI infrastructure at OFC 2026. Infraeo, an industry leader of high-performance...
