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282Test & MeasurementKeysight Introduces Infiniium XR8 Oscilloscopes to Accelerate High-Speed Digital Validation and Compliance
Next-generation architecture delivers faster analysis, clearer insights, and a compact design to turn days of digital validation into hours Keysight Technologies, Inc....
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263RohdeRohde & Schwarz highlights its comprehensive embedded systems test solutions at embedded world 2026
Embedded systems are fundamental to modern electronics, encompassing everything from power input and control PCBs to motors, sensors and user interfaces. Each...
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338Top 10 NewsWaveMaker Fuses Design and Development with Architecture-first Agentic Application Generation System for Enterprise Dev Teams
Brings deterministic outcomes and low, predictable costs to AI-assisted development for businesses WaveMaker, a leading application platform provider for enterprise-grade web and...
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288Top 10 NewsEnOcean 5 Click provides fast, bidirectional wireless connectivity communication for EnOcean-based sensors, switches, and actuators
Add low power, EnOcean Serial Protocol 3.0 (ESP3) gateway for building automation systems EnOcean 5 Click, a new wireless connectivity Click board™from...
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303Top 10 NewsNeoCortec presents sophisticated new network management interface for NeoMesh networks at Embedded World 2026
At Embedded World 2026 from 10th to 12th March 2026 in Nuremberg, Germany, NeoCortec, manufacturer of the ultra-low-power bi-directional wireless mesh networking...
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268RohdeRohde & Schwarz highlights its unique CMX500 one-box tester tailored for NTN testing at MWC Barcelona 2026
Rohde & Schwarz has expanded the capabilities of its CMX500 radio communication tester to cover all non-terrestrial network (NTN) technologies, making it...
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403Top 10 NewsAuraML Unveils Multimodal World Simulation Model Built on NVIDIA AI Infrastructure
Highlights– AuraML partners with NVIDIA to build a multimodal world simulation platform for robotics and logistics Launches AuraSim, India’s first multimodal world...
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236Top 10 NewsKeysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs
Solution addresses design bottleneck by automating complex workflows Keysight Technologies, Inc. (NYSE: KEYS) today introduced 3D Interconnect Designer, a new addition to...
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226RenesasRenesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era
Scalability and functional safety enabled by chiplet technology Auto-grade quality for large, modern AI NPUsAdvanced power control for higher performance, improved power...
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277RenesasRenesas Develops 3nm TCAM Technology Combining High Memory Density and Low Power, Suitable for Automotive SoCs
Achieves flexible, small-block configuration for large-scale TCAMs Cuts search energy and boosts speed through efficient search processing Enhanced functional safety enables application...
