• AI core, MCU and Wi-Fi/Bluetooth connectivity in one 43 x 44 x 3.2mm module
• See SIMCom at Embedded Worldon Booth3-525,Messe Nürnberg,Nuremburg, Germany, March 10-12 2026

SIMCom, a leading provider ofcellular wireless modules and solutions for IoT applications, has announced two new smart modules that incorporate AI and all the other functions necessary to simply and quickly add AI imaging functionality to a wide range of new applications.

Comments Mads Fischer, European Sales Director. SIMCom: “Our new smart AI modules target emerging imaging IoT applications that require AI functionality for positioning or identification. They give design engineers a head start by including the AI core, MCU and connectivity such as Wi-Fi and Bluetooth on one compact module, which can run easily available software.”

The SIM8666 and SIM8668 series areSIMCom’s basic Android system LTE smart AI modules. Available in a compact 43 x 44 x 3.2mm package, devices feature Rockchip’s 64-bit quad- core RK3566, RK3568 IoT chips, ARM Mali-G52 GPU,8M ISP HDR, and1T NPU compute utilities.Modules support Wi-Fi and BT short-range communication, H.264/H.265 4k@60fps decoding and H.264/H.265 1080p@60fps encoding, JPEG encoding/decoding, and more.

SIM8666and SIM8668 series modules have abundant interfaces, and can be connected with camera, display screen, audio, sensors and other equipment. Devices support multi-dimensional data collection and man-machine interaction. Interfaces including LVDS, MIPI-DSI, RGB, eDp, HDMI2.0,EBC, CSI, UART, SPI, I2C, GPIO, PWM, USB, PCIe, and SATA, make the smart AI modules very versatile. The embedded NPU supports INT8/INT16 mixed operations, making it easy to convert algorithm models based on a range of frameworks such as TensorFlow, MXNet, PyTorch, and Caffe, suiting the modules for applications including IoT gateway, smart business display, industrial control, smart hospital, smart central control and smart security.

Concludes Fischer: “Our new smart AI modules enable customers to rapidly develop and implement high computing power, multimedia, light AI designsat low cost for applications that we have not seen before.”