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Southco has launched the EC damping hinge, a soft-close hinge with the strength to bring ergonomic safety to industrial applications. Soft-close hinges...
New AEC-Q100 Grade 1 MRAM Delivers 10-Year Data Retention at 125°C, 48-Hour Burn-In, and Unlimited Endurance for Mission-Critical Systems Everspin Technologies, Inc....
The Wi-Fi chipset market size is expected to reach USD 36.06 Billion by 2034, according to a new study by Polaris Market Research. The...
Game-Changing Module Recognized for Transforming Automotive Electrification and Enabling Active Suspension System Innovations Vicor Corporation today announced it has won the Best...
Demonstration at SC25 showcases a 100 TiB-scale CXL memory pool overcoming the “memory wall” for next-generation AI models and inference-first workloads As...
The Gateway to Digital Transformation in Southeast Asia DigiTech ASEAN Thailand & AI Connect 2025, Your Southeast Asian face-to-face “Digital Solutions for...
Minister of Education, Govt. of India, Shri. Dharmendra Pradhan inaugurated the AI Innovation & Incubation Centre, a first-of-its-kind initiative that integrates Artificial...
LEMO, a global leader in leader in the design and manufacture of reliable high quality interconnect solutions, announces the launch of the...
Genspark, a leading startup that builds general-purpose AI agents and serves more than 20 million users worldwide, has selected Amazon Web Services...
Comau’s Head of Advanced Robotics, Giovanni Di Stefano, joined António Coutinho, CEO of EDP Innovation, for a Masterclass at Web Summit 2025,...
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