Advancing Integrated Engineering for the AI-Led Product Era with pre-validated, vertical-ready blueprints that unify hardware, software, digital, and AI stacks.

MosChip Technologies, a global silicon and product engineering company, announced that it will launch its new Product Xcelerate™ Blueprints at Embedded World North America, introducing a unified solutions suite that advances how OEMs design intelligent, connected products in the AI-Led Product Era.

At MosChip Booth [#4068], attendees will experience Product Xcelerate™ Blueprints in action. [Reserve your slot] for an exclusive demonstration.

As OEMs accelerate intelligent product development, integration challenges persist across hardware, software, and digital & AI lifecycles.

MosChip’s Integrated Engineering approach eliminates these barriers – aligning hardware, embedded software, digital and AI engineering design under a single, co-engineered lifecycle.

ProductXcelerate™ Blueprints are pre-validated, SMARC-aligned, vertical-ready reference designs that unify validated hardware platforms, embedded software stacks, MosChip DigitalSky GenAIoT™ modules, and AgenticSky™ cores – built to meet compliance, interoperability, and scalability requirements, enabling OEMs to design once, certify once, and scale confidently across product lines.

MosChip DigitalSky GenAIoT™ delivers connectivity and intelligence through edge-cloud orchestration, analytics, and intelligent automation, while AgenticSky™ cores (VisionCore, HMICore, WearableCore, ControllerCore)introduce Agentic AI traits – goal-orientation, adaptiveness, and autonomy – allowing machines, devices, and edge systems to sense, decide, and act predictably in the field.

Together, they define a seamless path from hardware to agentic AI, helping engineering teams accelerate development, simplify validation, and ensure long-term reliability.

Key Highlights

• Integrated by Design: Unified hardware, software, digital, and AI lifecycle for next-gen product development
• Pre-Validated & Vertical-Ready: SMARC-class modular design built for compliance and reuse
• AI-Infused Architecture: DigitalSky GenAIoT™ for connectivity and intelligence; AgenticSky™ for adaptiveness and autonomy
• Lifecycle-Continuous: OTA updates, traceability, and proactive optimization built in

These blueprints are designed to help OEMs cut integration cycles, reduce compliance risk, and accelerate product releases across generations.

“We’re bringing a modular, integrated engineering model to product development – pre-validated, reconfigurable, and built on stackable design blocks,” said Vishal Patil, Senior Vice President – Product Engineering BU at MosChip. “By integrating leading hardware ecosystems with embedded software stacks, DigitalSkyGenAIoT™ modules, and AgenticSky™ cores, we’re enabling OEMs to assemble and evolve next-generation products faster than ever.”

Live Demonstrations at Embedded World North America:

MosChip will showcase Product Xcelerate™ Blueprints that demonstrate how pre-validated, integrated frameworks accelerate OEM innovation:

• Automotive SDV GatewayBlueprint – Built on an automotive-grade, high-performance gateway platform aligned with SOAFEE and COVESA standards; integrates DigitalSky GenAIoT telemetry orchestration and AgenticSky ControllerCore for adaptive diagnostics
• Industrial & BMS Edge Gateway Blueprint – Powered by a multi-core industrial processor with IO-Link and BACnet connectivity; integrates DigitalSky GenAIoT edge-to-cloud orchestration with Agentic Sky ControllerCore for self-healing control and real-time optimization of energy and factory systems.
• Retail Auto-Checkout KioskBlueprint – Built on a high-performance, vision-optimized hardware platform with multi-sensor interfaces; integrates DigitalSky GenAIoT IoT & Cognitive modules and AgenticSkyVisionCore + HMICore to enable autonomous, transparent, and context-aware checkout experiences at the edge.
• Home Automation BridgeBlueprint – Developed on a low-power, multi-protocol controller with Matter-ready firmware stack; features DigitalSkyGenAIoT lifecycle automation and AgenticSkyControllerCore adaptive mesh recovery for resilient, intelligent home environments.
• Wearable CompanionBlueprint – Designed on an energy-efficient SoC optimized for Android-class wearables; integrates DigitalSkyGenAIoT health analytics with AgenticSkyWearableCore for proactive, continuous wellness insights and personalized feedback.
• Additional Blueprint Demonstrations – Highlighting modular reuse, cross-domain scalability, and the seamless progression from validated hardware to adaptive, Agentic AI-driven intelligence.

Each demo illustrates how MosChip’s pre-validated blueprints minimize integration effort, enable compliance, and establish a foundation for continuous intelligence.

“Today, the real differentiator for OEMs is how quickly and reliably they can turn proven hardware ecosystems into adaptive, intelligent products,” said Sribash Dey, Senior Vice President – NA & Europe Sales at MosChip. “ProductXcelerate™ Blueprints enable that transformation – turning engineering concepts into agentic products that evolve with intelligence and speed, ready for the AI-led product era.”