All posts tagged "Featured"
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884Electronics ComponentCUI Introduces Terminal Block Connectors to Interconnect Portfolio
CUI’s Interconnect Group today announced the addition of terminal block connectors to its existing line of connector products. Featuring up to 24...
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870Electronics ComponentFirst dev-kits available for mosaic, Septentrio’s new high-precision GNSS module
mosaic is Septentrio’s most compact high-precision GPS/GNSS receiver module. This next-generation receiver is now available for trial with its newly released development...
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1.1KInfineonInfineon is launching highly accurate digital Turbo MAP sensor
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is presenting the new XENSIV™ absolute pressure sensor series KP276 at the Sensor+Test trade...
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945STMicroelectronicsROM-Based GNSS Module from STMicroelectronics Targets Mass-Market Tracking and Navigation Applications
STMicroelectronics has enlarged its GNSS product offering with the Teseo-LIV3R ROM-based module. The competitively-priced module provides ST’s full GNSS algorithm capability for...
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1.5KTop 10 NewsEU photonics project gets thousands of girls in STEM
Thousands of young women and girls have had the chance to explore the world of science, engineering, and light technologies thanks to...
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975Electronics ComponentAnritsu Introduces First VNAs to Specify 43.5 GHz Performance in K-Connector Environment to Address Emerging High-frequency Applications
ShockLine™ VNAs Lower Cost-of-Test and Improve Time-to-Market in 5G, Satellite and Signal Integrity Applications − Anritsu Company introduces a 43.5 GHz frequency...
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1.0KRenesasRenesas Electronics Develops New Processing-In-Memory Technology for Next-Generation AI Chips
AI Accelerator Achieves Both CNN Processing Speeds and Reduced Power Consumption Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor...
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894Electronics ComponentVishay Intertechnology 1 A and 2 A FRED Pt® Ultrafast Rectifiers in SMP Package Increase Power Density, Improve Efficiency
Space-Saving 100 V and 200 V Devices Feature Compact 3.85 mm by 2.03 mm Footprint With Low 1 mm Profile Vishay Intertechnology,...
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1.1KRenesasRenesas Electronics Develops Low-Power Technology for Embedded Flash Memory Based on SOTB™ Process
Achieves Read Energy of 0.22 pJ/bit at 64 MHz – Among the World’s Lowest Levels for Embedded Flash Memory on an MCU...
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995AutomotiveRenesas Electronics Develops New Flash Memory Technology
New Technology Achieves Industry’s Largest Capacity of Embedded Flash Memory – 24 MB – and Industry’s Fastest Random Access Operation of 240...
