Strong partnership for innovative Advanced Packaging technologies With the shared objective of addressing the rapidly growing advanced packaging market through innovative, state-of-the-art...
Advanced Packaging for next-gen AI chips ASMPT will be exhibiting at NEPCON Japan from January 21 to 23, 2026. At booth E32-1t...
Mastering OSCs for maximum competitive advantage With the optimized SIPLACE OSC Package, technology and market leader ASMPT SMT Solutions is strengthening the...
Beginning of a new era: ASMPT takes off ASMPT, the global market and technology leader for manufacturing equipment in the semiconductor and...
A new era in semiconductor and electronics production At this year’s Productronica trade fair, ASMPT, the global market and technology leader in...
Digital services centrally bundled for intelligent manufacturing ASMPT SMT Solutions has introduced its new ASMPT SMT Customer Portal. It serves as a...
Transform your SMT production with ASMPT The hardware, software and Intelligent Factory concept presented by market and technology leader ASMPT drew strong...
Different supplier, same process In a joint project with Viscom, ASMPT has implemented an innovative solution for automatically adapting SMT and inspection...
ASMPT, the global leader in advanced packaging and assembly solutions, and KOKUSAI ELECTRIC CORPORATION, a pioneer in front-end semiconductor equipment, announced a...
Showcasing Advanced Packaging Solutions for AI and High-Performance Computing ASMPT, a global provider of advanced packaging and semiconductor assembly solutions, will participate...