Showcasing Advanced Packaging Solutions for AI and High-Performance Computing
ASMPT, a global provider of advanced packaging and semiconductor assembly solutions, will participate in SEMICON West 2025. Under the theme “Empower the Intelligence Revolution,” the company will showcase its advanced packaging portfolio on October 7–9, 2025 at booth #479 at the Phoenix Convention Center, demonstrating its commitment to driving innovations in AI, cloud computing, and high-performance computing technologies.
With the increasing demand for AI applications, AI accelerators and memory modules require improved performance, greater functionality and better power efficiency. This is achieved through high-density interconnects and heterogeneous integration. At SEMICON West, ASMPT will highlight its advanced packaging solutions designed to provide ultra-high bandwidth, low latency and dense integration – key for next-generation 2.5D and 3D-IC devices.
ASMPT’s advanced packaging portfolio includes the FIREBIRD thermo-compression bonding system featuring its innovative active oxide removal technology (AOR TCB™), the newly launched ALSI LASER1206 fully automatic laser dicing platform, the AMICRA NANO die attach solution offering ±0.2 µm precision, the NEXX Stratus™ P500 panel plating system, and the hybrid SIPLACE CA2 placement platform. These solutions help semiconductor manufacturers master complex integration tasks and support AI application development.
“At SEMICON West 2025, ASMPT will demonstrate how its packaging technologies address the growing demands of AI-driven applications,” said Jean-Marc Peallat, Regional Head, ASMPT Semiconductor Solutions Americas. “The event also provides an excellent opportunity to engage with industry experts, exchange ideas and contribute to the future of semiconductor manufacturing.”.
