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ASMPT introduces pick &place systemDALA for all camera module components

asmpt2pi0920 dala

Ideal Solution for Sensing and Imaging Applications

ASMPT, a global leader in semiconductor and electronics manufacturing hardware and software, introduces DALA, its latest pickandplace system for all camera module components.With a modular structure and cutting-edge quality bonding solutions, DALA offers flexibility, ensuring consistent quality while optimizing the total cost of ownership through efficient practices and adaptable in-line processes. Its advanced features position it as the preferred choice for today’s leading-edge AI consumer sensing and imaging applications.

Bestsolution for all camera module components

DALA emerges as a versatile solution catering to a wide array of camera module components, serving applications in consumer sensing and imaging, like smartphone cameras, smart electronics sensors, and automotive technologies such as ADAS. Featuring a modular structure that emphasizes adaptability for process and package conversions, DALA offers diverse dispensing systems and material input options, and effortlessly adjusts to various production needs with its different bonding modes. This fully automated system excels in tasks ranging from die, lens holder, or glass attachment, achieving precise bonding accuracy of ±7 µm, setting a new standard in its class. DALA stands out as the dependable choice for all pick-and-place tasks related to camera module components in consumer sensing and imaging applications.

Seamless integration with CMOS image sensor packaging inline

ASMPT leads the industry in delivering complete manufacturing solutions for CMOS image sensor packaging. DALA seamlessly integrates into ASMPT Smart COB Inline, a specialized chip-on-board (COB) inline solution designed for packaging CMOS image sensors.DALA playsa critical role within this system, managing high-precision die attachment at the beginning of the inline process and acting as the lens holder attach bonder at the conclusion of operations. This pivotal position establishes DALA as a core component within the complete COB Packaging Process, guaranteeing efficiency and precision across the assembly line.

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