Posts By Techmezine
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336ROHM SemiconductorROHM’s SiC MOSFETs Adopted in Schaeffler’s Inverter Brick, Now in Mass Production
ROHM and Schaeffler, a leading German automotive supplier, have started mass production of a new high-voltage inverter brick equipped with ROHM’s SiC...
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371MouserShaping the Future of Electronics: Mouser at Electronica India 2025
Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components™, will showcase...
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407Digi-KeyDigiKey Presents Factory Tomorrow Season 5 Video Series
New season “Behind the Robot” explores the unseen tech, infrastructure and innovation that powers modern automation DigiKey, the leading global electronic components...
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353Electronics ComponentVishay Intertechnology Automotive Grade MKP1848e DC Link Film Capacitor
Designed for Automotive, Energy, and Industrial Applications, AEC-Q200 Qualified Device Withstands Grade III THB Testing Vishay Intertechnology, Inc. (NYSE: VSH) today introduced...
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![[Photo] NEPCON JAPAN [September] 2025 Opens September 17, Set to Showcase 300 Exhibitors](https://www.techmezine.com/wp-content/uploads/2025/09/Photo-NEPCON-JAPAN-September-2025-Opens-September-17-Set-to-Showcase-300-Exhibitors-450x270.png)
![[Photo] NEPCON JAPAN [September] 2025 Opens September 17, Set to Showcase 300 Exhibitors](https://www.techmezine.com/wp-content/uploads/2025/09/Photo-NEPCON-JAPAN-September-2025-Opens-September-17-Set-to-Showcase-300-Exhibitors-80x80.png)
489Top 10 NewsNEPCON JAPAN [September] 2025 Opens September 17, Set to Showcase 300 Exhibitors
With only days to go, preparations are underway for NEPCON JAPAN [September] 2025, taking place from September 17–19 at Makuhari Messe. Known...
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427EMSASMPT Joins “JOINT3” Consortium to Develop Next-Generation Semiconductor Packaging
Global Advanced Packaging Leader Brings Proven Thermo-Compression Bonding Expertise to Next-Generation Panel-Level Innovation Platform ASMPT Limited (ASMPT), a leading global supplier of...
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324Top 10 NewsCADFEM India and IIT Roorkee Launch Pioneering Digital Twin Lab to Advance Simulation-Led Innovation
Partnership brings Ansys (now a part of Synopsys) Multiphysics tools and CADFEM expertise to empower research, curriculum, and skill development. IIT Roorkee’s...
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382Top 10 NewsTeledyne FLIR OEM Launches Boson+ IQ Thermal Imaging Development Kit at DSEI UK 2025
New Hardware and Software Development Kit Accelerates Thermal Imaging and AI Integration at the Edge. Teledyne FLIR OEM, part of Teledyne Technologies...
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364Top 10 NewsUSound MEMS Speaker Powers QCY MeloBuds N70, Setting a New Standard in TWS Audio
Powered by USound MEMS speaker technology, QCY’s newly launched MeloBuds N70 earbuds deliver Hi-Res clarity, low distortion, and advanced noise cancellation—setting a...
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328Test & MeasurementKaynes Semicon Selects Emerson’s NI Semiconductor Test Platform
Compact, PXI-based platform accelerates deployment, boosts throughput and delivers versatile test coverage for analog, mixed-signal and power chips Emerson, an industrial technology...
