Posts By Techmezine
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163RecomVersatile AC/DC Module Sets New Benchmark for Power Density
RECOM packs 65W into a miniature AC/DC module. The new cost-effective RACM65S-K/277 AC/DC module from RECOM achieves a class-leading power density of...
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172STMicroelectronicsSTMicroelectronics accelerates global adoption and market growth of Physical AI with NVIDIA
STMicroelectronics to integrate ST sensors, microcontrollers, and motor control solutions with NVIDIA robotics ecosystem to help developers design, train, and deploy humanoid...
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178Digi-KeyDigiKey Brings Cutting-Edge New Products to AI EXPO Taiwan 2026
The distributorwill feature components that enable AI to integrate into infinite possibilities like smart manufacturing, healthcare and automotive DigiKey, the global distribution...
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223TMENew ATTEND brand connectors for SIM and SD cards
By : TME The TME offer has been expanded with the assortment of connectors ATTEND from the 115U series. These are compact, durable,...
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228BlogEmerging Battery Testing Approaches: A New Era of Diagnostics
Source : Mouser Electronics As the world becomes increasingly electrified—from smartphones to electric vehicles (EVs)—the demand for high-performance, long-lasting, and safe batteries has...
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236UncategorizedOpenLight and TFC Advance Silicon Photonics Back‑End Integration Supporting up to 400G Data Rates on TGV Substrate
New evaluation board for a 400G EAM, based on OpenLight’s heterogeneous integration of InP-on-Si process, is available for testing, and includes a...
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165Electronics ComponentDanisense to exhibit at APEC 2026 in San Antonio, Texas, USA, March 22 – 26
Launch of new high precision DC and AC current clamp-on transducer Key points: Participation at APEC 2026, Henry B. Gonzalez Convention Center,...
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193UncategorizedTecumseh Launches New ‘Made in India’ TC3 Premium-Efficiency Compressor Platform
Introduces Orion, the new global fractional systems platform to support Refrigeration applications At ACREX India 2026, Tecumseh introduced the new TC3 premium-efficiency...
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243ROHM SemiconductorROHM has Introduced Reference Designs for Three-Phase Inverters Featuring New SiC Power Modules
ROHM has released reference designs “REF68005”, “REF68006”, and “REF68004” for three-phase inverter circuits featuring EcoSiC™ brand SiC molded modules “HSDIP20”, “DOT-247”, and...
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224HeilindMarket Insights – Heilind Electronics Q4 2025 Market Trend Insights: Strong Growth in Asia-Pacific Interconnect Market with AI and Data Centers as Core Drivers
Heilind Electronics, a global leader in interconnect and electronic component distribution, recently released its Q4 2025 market trend report. This report provides an...
