High-density power modules and 48V power delivery network enable midrange vehicles to adopt luxury feature Xiamen Hongfa Electroacoustic Co., Ltd (Hongfa) has...
A Strategic Partnership Accelerate New Industralisation and Microelectronics Development Hong Kong’s advanced manufacturing and microelectronics sector received a significant boost today with...
WORKS Integration – the data center for intelligent manufacturing With WORKS Integration, ASMPT SMT Solutions, the market and technology leader in SMT,...
After four successful online events with over 1000 participants, Rohde & Schwarz is hosting its fifth Satellite Industry Day on June 3,...
ROHM has expanded its portfolio of surface-mount near-infrared (NIR) LEDs with new compact top-view types. They are optimized for applications such as...
Navitas’ GaN and SiC technologies have been selected to support Nvidia’s 800 V HVDC data center power infrastructure to support 1 MW...
Space-Saving Device Offers Low Max. RthJC of 0.36 °C/W and Wettable Flanks to Improve Thermal Performance and Solderability in Industrial Applications To...
Next-generation PSU‘designed for production’ achieves OCP requirements for high-power, high-density server racks, enabled by GaNSafe™ ICs and Gen-3 Fast SiC MOSFETs. Navitas...
The Acronis Threat Research Unit (TRU) has uncovered a sophisticated cyber-espionage campaign orchestrated by the SideWinder Advanced Persistent Threat (APT) group, targeting...
World’s first device to integrate both charging and firing on single chip and shrinks power losses by 73%, enabling smaller, more powerful...