Advanced Packaging for next-gen AI chips
ASMPT will be exhibiting at NEPCON Japan from January 21 to 23, 2026. At booth E32-1t 1 in East Hall 7 of Tokyo Big Sight, the leading manufacturer of semiconductor manufacturing solutions will present its latest developments under the theme‘Empower the Intelligence Revolution’. This refers to the great importance of modern chip designs and packaging technologies for AI systems and other current developments such as smart mobility and hyper connectivity. ASMPT will provide information on a wide range of aspects of advanced packaging. The high-performance wire bonder AERO PRO will be on display at the booth.
“ASMPT SEMI Solutions is the pioneer, and enabler of the ‘Intelligence Revolution’”, says Takebumi Ochiai, Office Headat ASMPT Japan Ltd.“Our advanced packaging and high-end mainstream assembly solutions create tools for the invisible connections that make any kind of smart device, vehicle, and every data centermuch more intelligent.”
The AERO PRO, showcased at NEPCON, is ASMPT’s fine-pitch wire bonding solution for high-density semiconductor packages such as system-in-package (SiP), multi-chip modules (MCM), ball grid array (BGA), and land grid array (LGA). A new feature is the patented vertical wire bonding technology, GoV. It ensures excellent wire straightness and increases the stability and long-term reliability of wire connections under high electrical and thermal loads.The patented XPOWER ultrasonic transducer, which produces uniform 22 µm bond balls, supports mixed wire and vertical wire bonding in bond-via-array (BVA) technology and is optimised for complex connections, for example in memory modules or microcontroller units (MCUs). This makes AERO PRO ideal for demanding applications such as edge AI devices or power management ICs in electronic control units (ECUs).
The AERO PRO processes wire diameters from 0.5 to 2.0 mil (≈ 12.7–50.8 µm) and wire lengths from 0.2 to 8.0 mm – ideal for fine-pitch bonding on high-density substrates up to 105 × 300 mm.
Intelligent automation
The AERO PRO features AI-supported process monitoring. This includes the AERO EYE real-time monitoring system, AERO Diagnostic for analysis and AERO Predictive Maintenance for performance forecasting. Continuous quality control increases yield and operational efficiency. The AERO PRO is fully automatable and can be seamlessly integrated into automated guided vehicles (AGVs), rail-guided systems (RGVs), overhead conveyor systems (OHTs) and manufacturing execution systems (MES).
