Harwin
Recom
Electronics Component

Joint venture targets EUV infrastructure for high volume

an steegan
JSR that is a material company has recently signed a joint venture with imec according to which a new company will be set up with a goal to enable the manufacturing and quality control of all the EUV lithography materials. Basically EUV is critical to the advance nodes for the future use and thus imec will be focusing on the support and supply chain so as to prepare the overall infrastructure for maintaining the high end level manufacturing .
Accordingly this collaboration will allow to provide strength and deliver the best solution or the advance manufacturing series.

 

Allegro
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